Datasheet

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SBOS301A − MAY 2004 − REVISED MARCH 2007
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2
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage, V+ to V− 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signal Input Terminals, Voltage
(2)
(V−) −0.5V to (V+) + 0.5V. . . . .
Current
(2)
±10mA. . . . . . . . . . . . . . . . . . . .
Output Short-Circuit
(3)
Continuous. . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature −40°C to +85°C. . . . . . . . . . . . . . . . . . . . . .
Storage Temperature −55°C to +125°C. . . . . . . . . . . . . . . . . . . . . . .
Junction Temperature +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Rating (Human Body Model) 2000V. . . . . . . . . . . . . . . . . . . .
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2)
Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails should be current-limited to 10mA or less.
(3)
Short-circuit to ground.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PRECISION CURRENT MEASUREMENT
PRODUCTS
FEATURES PRODUCT
Logarithmic Transimpedance Amplifier, 5V, Eight Decades LOG114
Logarithmic Transimpedance, 36V, 7.5 Decades LOG112
Resistor-Feedback Transimpedance, 5V, 5.5 Decades
OPA380,
OPA381
Switched Integrator Transimpedance, Six Decades
IVC102
Direct Digital Converter, Six Decades
DDC112
ORDERING INFORMATION
(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
LOG114 QFN-16 RGV LOG114
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATION
Top View
QFN−16 (4mm x 4mm)
NC = No Connection
16
V
REF
V
O5
−
IN
5
+IN
5
15 14 13
1
2
3
4
V
REF GND
NC
I
2
I
1
5
V
CM IN
V
−
Com
V+
6
Exposed
thermal
die pad on
underside
(Must be
connected to V
−
)
78
12
11
10
9
V
O4
−
IN
4
+IN
4
V
LOGOUT
QFN-16