Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- RECOMMENDED OPERATING CONDITIONS
- THERMAL INFORMATION
- PACKAGE SPECIFICATIONS
- ELECTRICAL CHARACTERISTICS
- DEVICE INFORMATION
- TYPICAL CHARACTERISTICS (PVIN = VIN = 12 V) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the converter. Applies to , , and . The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to devices soldered directly to a 100 mm × 100 mm six-layer PCB with 1 oz. copper. Applies to , , and .
- TYPICAL CHARACTERISTICS (PVIN = VIN = 5 V) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the converter. Applies to , , and . The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to devices soldered directly to a 100 mm × 100 mm six-layer PCB with 1 oz. copper. Applies to , , and .
- APPLICATION INFORMATION
- ADJUSTING THE OUTPUT VOLTAGE
- Frequency Select
- CAPACITOR RECOMMENDATIONS FOR THE LMZ31530 POWER SUPPLY
- Transient Response
- Transient Waveforms Device configured for FCCM mode of operation, (pin 3 connected to pin 19).
- Application Schematics
- VIN and PVIN Input Voltage
- 3.3 V PVIN Operation
- Power Good (PWRGD)
- Slow Start (SS_SEL)
- Auto-Skip Eco-Mode / Forced Continuous Conduction Mode
- Power-Up Characteristics
- Pre-Biased Start-Up
- Remote Sense
- Output On/Off Inhibit (INH)
- Overcurrent Protection
- Current Limit (ILIM) Adjust
- Thermal Shutdown
- Layout Considerations
- EMI
- Revision History
LMZ31530
www.ti.com
SLVSBC7B –OCTOBER 2013–REVISED DECEMBER 2013
THERMAL INFORMATION
LMZ31530
THERMAL METRIC
(1)
RLG UNIT
72 PINS
θ
JA
Junction-to-ambient thermal resistance
(2)
Natural Convection 8.6
θ
JA(100LFM)
Junction-to-ambient thermal resistance
(3)
100 LFM 7.8
°C/W
ψ
JT
Junction-to-top characterization parameter
(4)
1.6
ψ
JB
Junction-to-board characterization parameter
(5)
4.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance, θ
JA
, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz.
copper and natural convection cooling. Additional airflow reduces θ
JA
.
(3) The junction-to-ambient thermal resistance, θ
JA
, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz.
copper and 100 LFM forced air cooling. Additional airflow reduces θ
JA
.
(4) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature, T
J
, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). T
J
= ψ
JT
* Pdis + T
T
; where Pdis is the power dissipated in the device and T
T
is
the temperature of the top of the device.
(5) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature, T
J
, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). T
J
= ψ
JB
* Pdis + T
B
; where Pdis is the power dissipated in the device and T
B
is
the temperature of the board 1mm from the device.
PACKAGE SPECIFICATIONS
LMZ31530 UNIT
Weight 4.96 grams
Flammability Meets UL 94 V-O
MTBF Calculated reliability Per Bellcore TR-332, 50% stress, T
A
= 40°C, ground benign 26.5 MHrs
Copyright © 2013, Texas Instruments Incorporated 3
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