Datasheet
LMZ31506
www.ti.com
SNVS993 –JUNE 2013
THERMAL INFORMATION
LMZ31506
THERMAL METRIC
(1)
RUQ47 UNIT
47 PINS
θ
JA
Junction-to-ambient thermal resistance
(2)
13
θ
JCtop
Junction-to-case (top) thermal resistance
(3)
9
θ
JCbot
Junction-to-case (bottom) thermal resistance
(4)
3.8
°C/W
θ
JB
Junction-to-board thermal resistance
(5)
6
ψ
JT
Junction-to-top characterization parameter
(6)
2.5
ψ
JB
Junction-to-board characterization parameter
(7)
5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance, θ
JA
, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with
1 oz. copper and natural convection cooling. Additional airflow reduces θ
JA
.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard
test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(6) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature, T
J
, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). T
J
= ψ
JT
* Pdis + T
T
; where Pdis is the power dissipated in the device and T
T
is
the temperature of the top of the device.
(7) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature, T
J
, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). T
J
= ψ
JB
* Pdis + T
B
; where Pdis is the power dissipated in the device and T
B
is
the temperature of the board 1mm from the device.
PACKAGE SPECIFICATIONS
LMZ31506 UNIT
Weight 1.26 grams
Flammability Meets UL 94 V-O
MTBF Calculated reliability Per Bellcore TR-332, 50% stress, T
A
= 40°C, ground benign 33.9 MHrs
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