Datasheet

LMZ31503
www.ti.com SNVS992 –JULY 2013
THERMAL INFORMATION
LMZ31503
THERMAL METRIC
(1)
RUQ47 UNIT
47 PINS
θ
JA
Junction-to-ambient thermal resistance
(2)
13
ψ
JT
Junction-to-top characterization parameter
(3)
2.5 °C/W
ψ
JB
Junction-to-board characterization parameter
(4)
5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance, θ
JA
, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with
1 oz. copper and natural convection cooling. Additional airflow reduces θ
JA
.
(3) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature, T
J
, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). T
J
= ψ
JT
* Pdis + T
T
; where Pdis is the power dissipated in the device and T
T
is
the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature, T
J
, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). T
J
= ψ
JB
* Pdis + T
B
; where Pdis is the power dissipated in the device and T
B
is
the temperature of the board 1mm from the device.
PACKAGE SPECIFICATIONS
LMZ31503 UNIT
Weight 1.26 grams
Flammability Meets UL 94 V-O
MTBF Calculated reliability Per Bellcore TR-332, 50% stress, T
A
= 40°C, ground benign 40.1 MHrs
Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMZ31503