Datasheet

LMZ23608
SNVS708F –MARCH 2011–REVISED OCTOBER 2013 www.ti.com
Pin Descriptions
Pin Name Description
1, 2 VIN Supply input — Nominal operating range is 6V to 36V. A small amount of internal capacitance is contained within the
package assembly. Additional external input capacitance is required between this pin and PGND.
3 SYNC Sync Input — Apply a CMOS logic level square wave whose frequency is between 350 kHz and 600 kHz to synchronize
the PWM operating frequency to an external frequency source. When not using synchronization this pin must be tied to
ground. The module free running PWM frequency is 350 kHz.
4 EN Enable — Input to the precision enable comparator. Rising threshold is 1.274V typical. Once the module is enabled, a 20
uA source current is internally activated to accommodate programmable hysteresis.
5, 6 AGND Analog Ground — Reference point for all stated voltages. Must be externally connected to EP/PGND.
7 FB Feedback — Internally connected to the regulation, over-voltage, and short-circuit comparators. The regulation reference
point is 0.8V at this input pin. Connect the feedback resistor divider between the output and AGND to set the output
voltage.
8 SS Soft-Start/Track input — To extend the 1.6 mSec internal soft-start connect an external soft start capacitor. For tracking
connect to an external resistive divider connected to a higher priority supply rail. See Design Steps for the LMZ23608
Application section.
9 SH Share pin. Connect this to the share pin of other LMZ23608 modules to share the load between the devices. One device
should be configured as the master by connecting the FB normally. All other devices should be configured as slaves by
leaving their respective FB pins floating. Leave this pin floating if not used, do not ground. See Design Steps for the
LMZ23608 Application section.
10, VOUT Output Voltage — Output from the internal inductor. Connect the output capacitor between this pin and PGND.
11
EP PGND Exposed Pad / Power Ground Electrical path for the power circuits within the module. — NOT Internally connected to
AGND / pin 5. Used to dissipate heat from the package during operation. Must be electrically connected to pin 5 external
to the package.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
VIN to PGND -0.3V to 40V
EN, SYNC to AGND -0.3V to 5.5V
SS, FB, SH to AGND -0.3V to 2.5V
AGND to PGND -0.3V to 0.3V
Junction Temperature 150°C
Storage Temperature Range -65°C to 150°C
ESD Susceptibility
(3)
± 2 kV
For soldering specifications:
see product folder at www.ti.com and SNOA549
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-114.
Operating Ratings
(1)
VIN 6V to 36V
EN, SYNC 0V to 5.0V
Operation Junction Temperature −40°C to 125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
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Product Folder Links: LMZ23608