Datasheet

LMZ22010
www.ti.com SNVS687G –MARCH 2011–REVISED OCTOBER 2013
Figure 59. Layout example
Power Module SMT Guidelines
The recommendations below are for a standard module surface mount assembly
• Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads
• Stencil Aperture
– For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land
pattern
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