Datasheet
20 40 60 80 100 120
0
2
4
6
8
10
12
MAXIMUM OUTPUT CURRENT (A)
TEMPERATURE (C)
JA = 9.9 °C/W
JA = 6.8 °C/W
JA = 5.2 °C/W
0 2 4 6 8 10 12
3
6
9
12
15
18
21
24
27
30
THETA JA (°C/W)
COPPER AREA (in
2
)
2 Layer 0 LFPM
2 Layer 225 LFPM
4 Layer 0 LFPM
4 Layer 225 LFPM
LMZ22010
www.ti.com
SNVS687G –MARCH 2011–REVISED OCTOBER 2013
Typical Performance Characteristics (continued)
Unless otherwise specified, the following conditions apply: V
IN
= 12V; C
IN
= three x 10μF + 47nF X7R Ceramic; C
OUT
= two x
330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; C
FF
= 4.7nF; Tambient = 25° C for waveforms. All indicated
temperatures are ambient.
Thermal derating V
IN
= 12V, V
OUT
= 3.3V θ
JA
vs copper heat sinking area
Figure 36. Figure 37.
Output ripple Output ripple
12V
IN
, 5.0V
OUT
@ Full Load, BW = 20 MHz 12V
IN
, 5.0V
OUT
@ Full Load, BW = 250 MHz
Figure 38. Figure 39.
Output ripple Output ripple
12V
IN
, 3.3V
OUT
@ Full Load, BW = 20 MHz 12V
IN
, 3.3V
OUT
@ Full Load, BW = 250 MHz
Figure 40. Figure 41.
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LMZ22010