Datasheet

LMZ22008
www.ti.com
SNVS712G FEBRUARY 2010REVISED OCTOBER 2013
Figure 56. Layout example
Power Module SMT Guidelines
The recommendations below are for a standard module surface mount assembly
Land Pattern Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads
Stencil Aperture
For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land
pattern
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