Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- Electrical Specifications
- Performance Benefits
- Absolute Maximum Ratings
- Operating Ratings
- Electrical Characteristics
- Typical Performance Characteristics
- Block Diagram
- Design Steps for the LMZ22005 Application
- ENABLE DIVIDER, RENT, RENB AND RENHSELECTION
- OUTPUT VOLTAGE SELECTION
- SOFT-START CAPACITOR SELECTION
- TRACKING SUPPLY DIVIDER OPTION
- CO SELECTION
- CIN SELECTION
- POWER DISSIPATION AND BOARD THERMAL REQUIREMENTS
- PC BOARD LAYOUT GUIDELINES
- Additional Features
- Typical Application Schematic Diagram
- Power Module SMT Guidelines
- Revision History
LMZ22005
www.ti.com
SNVS686I –MARCH 2011–REVISED OCTOBER 2013
Figure 52. Top View Demonstration Board – See AN–2125 SNVA473
Power Module SMT Guidelines
The recommendations below are for a standard module surface mount assembly
• Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads
• Stencil Aperture
– For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land
pattern
– For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation
• Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher
• Stencil Thickness – 0.125 to 0.15mm
• Reflow - Refer to solder paste supplier recommendation and optimized per board size and density
• Maximum number of reflows allowed is one
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