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LMZ22003

www.ti.com

SNVS658H –MARCH 2011–REVISED OCTOBER 2013

LMZ22003 3A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage

Check for Samples: LMZ22003

FEATURES

DESCRIPTION

• Integrated Shielded Inductor

The LMZ22003 SIMPLE SWITCHER© power module

• Simple PCB Layout

is an easy-to-use step-down DC-DC solution capable

of driving up to 3A load. The LMZ22003 is available

• Frequency Synchronization Input (650 kHz to

in an innovative package that enhances thermal

950 kHz)

performance and allows for hand or machine

• Flexible Startup Sequencing Using External

soldering.

Soft-start, Tracking and Precision Enable

The LMZ22003 can accept an input voltage rail

• Protection Against Inrush Currents and Faults

between 6V and 20V and deliver an adjustable and

such as Input UVLO and Output Short Circuit

highly accurate output voltage as low as 0.8V. The

• – 40°C to 125°C Junction Temperature Range

LMZ22003 only requires two external resistors and

three external capacitors to complete the power

• Single Exposed Pad and Standard Pinout for

solution. The LMZ22003 is a reliable and robust

Easy Mounting and Manufacturing

design with the following protection features: thermal

• Fast Transient Response for Powering FPGAs

shutdown, programmable input under-voltage lockout,

and ASICs

output over-voltage protection, short-circuit protection,

• Fully Enabled for Webench® Power Designer

output current limit, and allows startup into a pre-

biased output. The sync input allows synchronization

• Pin Compatible with

over the 650 to 950 kHz switching frequency range.

LMZ23605/LMZ23603/LMZ22005

ELECTRICAL SPECIFICATIONS

APPLICATIONS

• 18W Maximum Total Output Power

• Point of Load Conversions from 12V Input Rail

• Up to 3A Output Current

• Time Critical Projects

• Input Voltage Range 6V to 20V

• Space Constrained / High Thermal

Requirement Applications • Output Voltage Range 0.8V to 6V

• Negative Output Voltage Applications • Efficiency up to 92%

See AN-2027 SNVA425

PERFORMANCE BENEFITS

• High Efficiency Reduces System Heat

Generation

• Complies with EN55022 Class B

(2)

• Low Component Count, Only 5 External

Components

• Low Output Voltage Ripple

• Uses PCB as Heat Sink, no Airflow Required

Figure 1. Easy To Use 7 Pin Package

10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in)

= 12°C/W, θ

= 1.9°C/W

(1)

RoHS Compliant

Peak Reflow Case Temp = 245°C

Power Module SMT Guidelines

(1) Theta JA measured on a 3.5” x 3.5 ” four layer board, with

three ounce copper on outer layers and two ounce copper on (2) EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007.

inner layers, sixty thermal vias, no air flow, and 1W power See AN-2125 SNVA473 and layout for information on device

dissipation. Refer to application note layout diagrams. under test. Vin = 12V, Vo = 3.3V, Io = 3A

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (31 pages)

PAGE 1
LMZ22003 www.ti.
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com System Performance Efficiency VIN = 12V VOUT = 5.0V 100 4 90 3 70 DISSIPATION (W) EFFICIENCY (%) 80 60 50 2 40 30 1 20 10 0 0 0 1 2 OUTPUT CURRENT (A) 3 Thermal Derating Curve VIN = 12V VOUT = 5.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 Simplified Application Schematic VOUT SS/TRK FB AGND PGND EN VIN VIN SYNC LMZ22003 VOUT 6V 5V 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.8V RFBT 15.4k 5.62k 3.32k 2.26k 1.87k 1.00k 1.07k 1.62k 0 RFBB 2.37k 1.07k 1.07k 1.07k 1.50k 1.13k 2.05k 6.49k 8.06K VIN Range 10...20V 9...20V 7...20V 6...20V 6...20V 6...20V 6...20V 6...20V 6...20V VOUT @ 3A RFBT See Table CIN Enable RFBB CSS 22 PF See Table 0.
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 Absolute Maximum Ratings www.ti.com (1) (2) VIN to PGND -0.3V to 24V EN, SYNC to AGND -0.3V to 5.5V SS/TRK, FB to AGND -0.3V to 2.5V AGND to PGND -0.3V to 0.3V Junction Temperature 150°C Storage Temperature Range ESD Susceptibility -65°C to 150°C (3) ± 2 kV Peak Reflow Case Temperature (30 sec) 245°C For soldering specifications, refer to the following document: www.ti.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 Electrical Characteristics (continued) Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10μF + 1μF X7R Ceramic; CO = 220μF Specialty Polymer + 10 uF Ceramic; TAmbient = 25° C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher Output ripple – See Design Steps for the LMZ22003 Application section. Efficiency 6.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10μF + 1μF X7R Ceramic; CO = 220μF Specialty Polymer + 10 uF Ceramic; TAmbient = 25° C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher Output ripple – See Design Steps for the LMZ22003 Application section. Efficiency 2.
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10μF + 1μF X7R Ceramic; CO = 220μF Specialty Polymer + 10 uF Ceramic; TAmbient = 25° C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher Output ripple – See Design Steps for the LMZ22003 Application section. Efficiency 1.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10μF + 1μF X7R Ceramic; CO = 220μF Specialty Polymer + 10 uF Ceramic; TAmbient = 25° C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher Output ripple – See Design Steps for the LMZ22003 Application section. Efficiency 6.
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10μF + 1μF X7R Ceramic; CO = 220μF Specialty Polymer + 10 uF Ceramic; TAmbient = 25° C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher Output ripple – See Design Steps for the LMZ22003 Application section. Efficiency 2.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10μF + 1μF X7R Ceramic; CO = 220μF Specialty Polymer + 10 uF Ceramic; TAmbient = 25° C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher Output ripple – See Design Steps for the LMZ22003 Application section. Efficiency 1.
PAGE 12
LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10μF + 1μF X7R Ceramic; CO = 220μF Specialty Polymer + 10 uF Ceramic; TAmbient = 25° C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher Output ripple – See Design Steps for the LMZ22003 Application section.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 2 x 10μF + 1μF X7R Ceramic; CO = 220μF Specialty Polymer + 10 uF Ceramic; TAmbient = 25° C for waveforms. Efficiency and dissipation plots marked with * have cycle skipping at light loads resulting is slightly higher Output ripple – See Design Steps for the LMZ22003 Application section.
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com BLOCK DIAGRAM Linear Regulator 2M VIN 1 3 3 CIN EN CBST CINint 1 SYNC CSS 2 800 kHz PWM SS/TRK 3.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 DESIGN STEPS FOR THE LMZ22003 APPLICATION The LMZ22003 is fully supported by Webench® which offers: component selection, electrical and thermal simulations. Additionally there are both evaluation and demonstration boards that may be used as a starting point for design. The following list of steps can be used to manually design the LMZ22003 application. All references to values refer to the typical applications schematic Figure 51.
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com VIN INT-VCC (5V) 21 PA 2.0M RENT 42.2k RENH ENABLE RUN 100: 5.1V RENB 12.7k 1.279V Figure 46. Enable Input Detail OUTPUT VOLTAGE SELECTION Output voltage is determined by a divider of two resistors connected between VO and ground. The midpoint of the divider is connected to the FB input. The regulated output voltage determined by the external divider resistors RFBT and RFBB is: VO = 0.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 TRACKING SUPPLY DIVIDER OPTION The tracking function allows the module to be connected as a slave supply to a primary voltage rail (often the 3.3V system rail) where the slave module output voltage is lower than that of the master. Proper configuration allows the slave rail to power up coincident with the master rail such that the voltage difference between the rails during ramp-up is small (i.e. <0.15V typ).
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com (As a point of reference, the worst case ripple current will occur when the module is presented with full load current and when VIN = 2 * VO). Recommended minimum input capacitance is 22uF X7R (or X5R) ceramic with a voltage rating at least 25% higher than the maximum applied input voltage for the application. It is also recommended that attention be paid to the voltage and temperature derating of the capacitor selected.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 VIN VO LMZ22003 VOUT VIN High di/dt Cin1 CO1 GND Loop 2 Loop 1 Figure 48. PC Board Layout 1. Minimize area of switched current loops. From an EMI reduction standpoint, it is imperative to minimize the high di/dt paths during PC board layout as shown in Figure 48.
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com OUTPUT OVER-VOLTAGE PROTECTION If the voltage at FB is greater than a 0.86V internal reference, the output of the error amplifier is pulled toward ground, causing VO to fall. CURRENT LIMIT The LMZ22003 is protected by both low side (LS) and high side (HS) current limit circuitry. The LS current limit detection is carried out during the off-time by monitoring the current through the LS synchronous MOSFET.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 Figure 50. CCM and DCM Operating Modes VIN = 12V, VO = 3.3V, IO = 3A/0.3A 2 μsec/div The approximate formula for determining the DCM/CCM boundary is as follows: IDCB≊VO*(VIN–VO)/(2*3.3 μH*fSW(CCM)*VIN) (13) The inductor internal to the module is 3.3 μH. This value was chosen as a good balance between low and high input voltage applications. The main parameter affected by the inductor is the amplitude of the inductor ripple current (ILR).
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Table 1. Typical Application Bill of Materials Ref Des Description Case Size Manufacturer Manufacturer P/N U1 SIMPLE SWITCHER ® PFM-7 Texas Instruments LMZ22003TZ Cin1,5 0.047 µF, 50V, X7R 1206 Yageo America CC1206KRX7R9BB473 Cin2,3 10 µF, 50V, X7R 1210 Taiyo Yuden UMK325BJ106MM-T Cin6 (OPT) CAP, AL, 150µF, 50V Radial G Panasonic EEE-FK1H151P CO1,6 0.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 Figure 53.
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LMZ22003 SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Figure 54. Sample Reflow Profile Table 2. 24 Probe Max Temp (°C) Reached Max Temp Time Above 235°C Reached 235°C Time Above 245°C Reached 245°C Time Above 260°C Reached 260°C #1 242.5 6.58 0.49 6.39 0.00 – 0.00 – #2 242.5 7.10 0.55 6.31 0.00 7.10 0.00 – #3 241.0 7.09 0.42 6.44 0.00 – 0.
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LMZ22003 www.ti.com SNVS658H – MARCH 2011 – REVISED OCTOBER 2013 REVISION HISTORY Changes from Revision G (March 2013) to Revision H Page • Added Peak Reflow Case Temp = 245°C ............................................................................................................................ 1 • Deleted 10mil ........................................................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 2-Oct-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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PACKAGE MATERIALS INFORMATION www.ti.com 3-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMZ22003TZE/NOPB TOPMOD NDW 7 250 330.0 24.4 10.6 14.22 5.0 16.0 24.0 Q2 LMZ22003TZX/NOPB TOPMOD NDW 7 500 330.0 24.4 10.6 14.22 5.0 16.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 3-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ22003TZE/NOPB TO-PMOD NDW 7 250 367.0 367.0 45.0 LMZ22003TZX/NOPB TO-PMOD NDW 7 500 367.0 367.0 45.
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MECHANICAL DATA NDW0007A BOTTOM SIDE OF PACKAGE TOP SIDE OF PACKAGE TZA07A (Rev D) www.ti.
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