Datasheet

200 mV/div
1 ms/div
1.0 A/div
IOUT
VOUT=12V
200 mV/div
1 ms/div
1.0 A/div
IOUT
VOUT=12V
20 mV/div
1 µs/div
VOUT=5V
100 mV/div
1 µs/div
VOUT=12V
0.0 0.5 1.0 1.5 2.0 2.5 3.0
11.6
11.8
12.0
12.2
12.4
12.6
OUTPUT VOLTAGE (V)
OUTPUT CURRENT (A)
VIN = 15V
VIN = 24V
VIN = 30V
VIN = 36V
VIN = 42V
±1%
0 10 20 30 40 50 60
0
5
10
15
20
25
30
35
40
THERMAL RESISTANCE 
JA
(°C/W)
BOARD AREA (cm
2
)
0LFM (0m/s) air
225LFM (1.14m/s) air
500LFM (2.54m/s) air
Evaluation Board Area
LMZ14203H
www.ti.com SNVS692D –JANUARY 2011–REVISED OCTOBER 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, the following conditions apply: V
IN
= 24V; Cin = 10uF X7R Ceramic; C
O
= 47uF; T
AMB
= 25°C.
Package Thermal Resistance θ
JA
4 Layer Printed Circuit Board with 1oz Copper Line and Load Regulation T
AMB
= 25°C
Figure 37. Figure 38.
Output Ripple
Output Ripple
V
IN
= 24V, I
OUT
= 3A, Polymer Electrolytic C
OUT
, BW = 200
V
IN
= 12V, I
OUT
= 3A, Ceramic C
OUT
, BW = 200 MHz MHz
Figure 39. Figure 40.
Load Transient Response V
IN
= 24V V
OUT
= 12V Load Transient Response V
IN
= 24V V
OUT
= 12V
Load Step from 10% to 100% Load Step from 30% to 100%
Figure 41. Figure 42.
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