Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- Electrical Specifications
- Performance Benefits
- Absolute Maximum Ratings
- Operating Ratings
- Electrical Characteristics
- Typical Performance Characteristics
- Application Block Diagram
- Revision History
LMZ14202EXT
SNVS665F –JUNE 2010–REVISED OCTOBER 2013
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Figure 38. Top and Bottom View of Board
Power Module SMT Guidelines
The recommendations below are for a standard module surface mount assembly
• Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads
• Stencil Aperture
– For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land
pattern
– For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation
• Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher
• Stencil Thickness – 0.125 to 0.15mm
• Reflow - Refer to solder paste supplier recommendation and optimized per board size and density
• Maximum number of reflows allowed is one
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