Datasheet

LMZ12010

SNVS667G –FEBRUARY 2010–REVISED OCTOBER 2013

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pattern

– For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation

• Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher.

• Stencil Thickness – 0.125 to 0.15mm

• Reflow - Refer to solder paste supplier recommendation and optimized per board size and density

• Maximum number of reflows allowed is one

Figure 57. Sample Reflow Profile

Table 3.

Max Temp Reached Time Above Reached Time Above Reached Time Above Reached

Probe

(°C) Max Temp 235°C 235°C 245°C 245°C 260°C 260°C

#1 242.5 6.58 0.49 6.39 0.00 – 0.00 –

#2 242.5 7.10 0.55 6.31 0.00 7.10 0.00 –

#3 241.0 7.09 0.42 6.44 0.00 – 0.00 –

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