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LMZ12008

www.ti.com

SNVS716F –MARCH 2011–REVISED OCTOBER 2013

LMZ12008 8A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage

Check for Samples: LMZ12008

FEATURES

DESCRIPTION

• Integrated Shielded Inductor

The LMZ12008 SIMPLE SWITCHER© power module

• Simple PCB Layout

is an easy-to-use step-down DC-DC solution capable

of driving up to 8A load. The LMZ12008 is available

• Fixed Switching Frequency (350kHz)

in an innovative package that enhances thermal

• Flexible Startup Sequencing Using External

performance and allows for hand or machine

Soft-start, Tracking and Precision Enable

soldering.

• Protection Against Inrush Currents and Faults

The LMZ12008 can accept an input voltage rail

such as Input UVLO and Output Short Circuit

between 6V and 20V and deliver an adjustable and

• –40°C to 125°C Junction Temperature Range

highly accurate output voltage as low as 0.8V. The

• Single Exposed Pad and Standard Pinout for

LMZ12008 only requires two external resistors and

external capacitors to complete the power solution.

Easy Mounting and Manufacturing

The LMZ12008 is a reliable and robust design with

• Fully Enabled for Webench® Power Designer

the following protection features: thermal shutdown,

• Pin Compatible with LMZ22010/08/06,

programmable input under-voltage lockout, output

LMZ12010/06, LMZ23610/08/06, and

over-voltage protection, short-circuit protection, output

LMZ13610/08/06

current limit, and allows startup into a pre-biased

output.

APPLICATIONS

ELECTRICAL SPECIFICATIONS

• Point of Load Conversions from 12V Input Rail

• 40W Maximum Total Output Power

• Time Critical Projects

• Up to 8A Output Current

• Space Constrained / High Thermal

Requirement Applications

• Input Voltage Range 6V to 20V

• Negative Output Voltage Applications

• Output Voltage Range 0.8V to 6V

See AN-2027 SNVA425.

• Efficiency up to 92%

PERFORMANCE BENEFITS

• High Efficiency Reduces System Heat

Generation

• Low Radiated Emissions (EMI) Complies with

EN55022

(2)

• Only 7 External Components

• Low Output Voltage Ripple

• No External Heat Sink Required

Figure 1. Easy to use PFM 11 Pin Package

15 x 17.79 x 5.9 mm (0.59 x 0.7 x 0.232 in)

θJA = 9.9°C/W, θJC = 1.0 °C/W

(1)

RoHS Compliant

Peak Reflow Case Temp = 245°C

Power Module SMT Guidelines

(2) EN 55022:2006, +A1:2007, FCC Part 15 Subpart B, tested on

(1) θ

measured on a 75mm x 90 mm four-layer PCB Evaluation Board with EMI configuration

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (30 pages)

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LMZ12008 www.ti.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com System Performance Figure 2. Efficiency VIN = 12V, VOUT = 3.3V 100 EFFICIENCY (%) 90 80 70 60 50 12Vin 40 0 1 2 3 4 5 6 OUTPUT CURRENT (A) 7 8 Figure 3. Thermal derating curve VIN = 12V, VOUT = 3.3V OUTPUT CURRENT (A) 10 8 6 4 2 0 JA = 9.9 °C/W 20 30 40 50 60 70 80 90 100 110 120 AMBIENT TEMPERATURE (°C) Figure 4.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 Simplified Application Schematic VOUT 6V 5V 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.8V VOUT SS FB AGND PGND VIN EN VIN LMZ12008 RFBT 15.4k 5.62k 3.32k 2.26k 1.87k 1.00k 1.07k 1.62k 0 RFBB VIN Range 2.37k 8.5...20V 1.07k 7...20V 1.07k 6...20V 1.07k 6...20V 1.50k 6...20V 1.13k 6...20V 2.05k 6...20V 6.49k 6...20V 4.02k 6...20V VOUT CFF 4.7 nF (OPT) Enable RFBT See Table CSS CIN 3 x 10 PF 0.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) VIN to PGND -0.3V to 24V EN to AGND -0.3V to 5.5V SS, FB to AGND -0.3V to 2.5V AGND to PGND -0.3V to 0.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 Electrical Characteristics (continued) Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Efficiency 5.0V output @ 25°C Dissipation 5.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 1.8V output @ 25°C 7 80 6 DISSIPATION (W) EFFICIENCY (%) Efficiency 1.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 1.0V output @ 25°C 7 80 6 70 DISSIPATION (W) EFFICIENCY (%) Efficiency 1.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 2.5V output @ 85°C 8 90 7 80 6 DISSIPATION (W) EFFICIECNY (%) Efficiency 2.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Dissipation 1.2V output @ 85°C 8 80 7 70 6 DISSIPATION (W) EFFICIENCY (%) Efficiency 1.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. θJA vs copper heat sinking area Thermal derating VIN = 12V, VOUT = 3.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. Output ripple 12VIN, 1.2VOUT @ Full Load, BW = 20 MHz Output ripple 12VIN, 1.2VOUT@ Full Load, BW = 250 MHz Figure 42. Figure 43.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; CIN = three x 10μF + 47nF X7R Ceramic; COUT = two x 330μF Specialty Polymer + 47 uF Ceramic + 47nF Ceramic; CFF = 4.7nF; Tambient = 25° C for waveforms. All indicated temperatures are ambient. 3.3VOUT Soft Start, no CSS 3.3VOUT Soft Start, CSS = 0.47uF Figure 48. Figure 49.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com BLOCK DIAGRAM Linear Regulator 2M VIN 1 3 3 CIN EN CBST CINint 1 2.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 DESIGN STEPS FOR THE LMZ12008 APPLICATION The LMZ12008 is fully supported by Webench® which offers: component selection, electrical and thermal simulations. Additionally, there are both evaluation and demonstration boards that may be used as a starting point for design. The following list of steps can be used to manually design the LMZ12008 application. All references to values refer to the typical applications schematic Figure 55.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com INT-VCC (5V) VIN 13 PA 2.0M RENT 42.2k RENH ENABLE RUN 100: 5.1V RENB 12.7k 1.274V Figure 50. Enable input detail OUTPUT VOLTAGE SELECTION Output voltage is determined by a divider of two resistors connected between VOUT and AGND. The midpoint of the divider is connected to the FB input. The regulated output voltage determined by the external divider resistors RFBT and RFBB is: VOUT = 0.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 TRACKING SUPPLY DIVIDER OPTION The tracking function allows the module to be connected as a slave supply to a primary voltage rail (often the 3.3V system rail) where the slave module output voltage is lower than that of the master. Proper configuration allows the slave rail to power up coincident with the master rail such that the voltage difference between the rails during ramp-up is small (i.e. <0.15V typ).
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com One recommended output capacitor combination is two 330μF, 15 mOhm ESR tantalum polymer capacitors connected in parallel with a 47 uF 6.3V X5R ceramic. This combination provides excellent performance that may exceed the requirements of certain applications. Additionally some small 47nF ceramic capacitors can be used for high frequency EMI suppression. CIN SELECTION The LMZ12008 module contains two internal ceramic input capacitors.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 Board Area_cm2 8 500 . °C x cm 2 TCA W (15) As a result, approximately 27.42 square cm of 2 oz copper on top and bottom layers is the minimum required area for the example PCB design. This is 5.23 x 5.23 cm (2.06 x 2.06 in) square. The PCB copper heat sink must be connected to the exposed pad. For best performance, use approximately 100, 8mil thermal vias spaced 59 mil (1.5 mm) apart connect the top copper to the bottom copper.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com 2. Have a single point ground. The ground connections for the feedback, soft-start, and enable components should be routed to the AGND pin of the device. This prevents any switched or load currents from flowing in the analog ground traces. If not properly handled, poor grounding can result in degraded load regulation or erratic output voltage ripple behavior. Additionally provide a single point ground connection from pin 4 (AGND) to EP/PGND.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 Figure 53. Pre-Biased Startup DISCONTINUOUS CONDUCTION AND CONTINUOUS CONDUCTION MODES At light load the regulator will operate in discontinuous conduction mode (DCM). With load currents above the critical conduction point, it will operate in continuous conduction mode (CCM). When operating in DCM, inductor current is maintained to an average value equaling Iout .
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 www.ti.com Typical Application Schematic Diagram and BOM CIN6 (OPT) + CIN5 VOUT SS FB PGND AGND V IN EN VIN LMZ12008 V OUT RENT (OPT) CIN2,3,4 CIN1 D1 5.1V (OPT) CO 3,4 CSS RENB CO1 (OPT) CO 2 CO5 (OPT) LOAD (OPT) RFBB RFBT Figure 55. Table 1.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 Figure 56.
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LMZ12008 SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 • • • • www.ti.com – For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher Stencil Thickness – 0.125 to 0.15mm Reflow - Refer to solder paste supplier recommendation and optimized per board size and density Maximum number of reflows allowed is one Figure 57. Sample Reflow Profile Table 2.
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LMZ12008 www.ti.com SNVS716F – MARCH 2011 – REVISED OCTOBER 2013 REVISION HISTORY Changes from Revision E (March 2013) to Revision F Page • Added Peak Reflow Case Temp = 245°C ............................................................................................................................ 1 • Deleted 10mils ......................................................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LMZ12008TZE/NOPB Package Package Pins Type Drawing PFM NDY 11 SPQ 250 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 32.4 Pack Materials-Page 1 15.45 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 18.34 6.2 20.0 32.
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PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ12008TZE/NOPB PFM NDY 11 250 367.0 367.0 55.
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MECHANICAL DATA NDY0011A BOTTOM SIDE OF PACKAGE TOP SIDE OF PACKAGE TZA11A (Rev F) www.ti.
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