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LMZ12003

www.ti.com

SNVS636N –DECEMBER 2009–REVISED OCTOBER 2013

LMZ12003 3A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage

Check for Samples: LMZ12003

FEATURES

DESCRIPTION

• Integrated Shielded Inductor

The LMZ12003 SIMPLE SWITCHER power module

• Simple PCB Layout

is an easy-to-use step-down DC-DC solution capable

of driving up to 3A load with exceptional power

• Flexible Startup Sequencing Using External

conversion efficiency, line and load regulation, and

Soft-start Capacitor and Precision Enable

output accuracy. The LMZ12003 is available in an

• Protection Against Inrush Currents and Faults

innovative package that enhances thermal

such as Input UVLO and Output Short Circuit

performance and allows for hand or machine

• -40°C to 125°C Junction Temperature Range

soldering.

• Single Exposed Pad and Standard Pinout for

The LMZ12003 can accept an input voltage rail

Easy Mounting and Manufacturing

between 4.5V and 20V and deliver an adjustable and

highly accurate output voltage as low as 0.8V. The

• Fast Transient Response for FPGAs and

LMZ12003 only requires three external resistors and

ASICs

four external capacitors to complete the power

• Low Output Voltage Ripple

solution. The LMZ12003 is a reliable and robust

• Pin-to-pin Compatible Family:

design with the following protection features: thermal

shutdown, input under-voltage lockout, output over-

– LMZ14203/2/1 (42V Max 3A, 2A, 1A)

voltage protection, short-circuit protection, output

– LMZ12003/2/1 (20V Max 3A, 2A, 1A)

current limit, and allows startup into a pre-biased

• Fully Webench® Power Designer Enabled

output. A single resistor adjusts the switching

frequency up to 1 MHz.

APPLICATIONS

ELECTRICAL SPECIFICATIONS

• Point of Load Conversions from 5V and 12V

Input Rail

• 18W Maximum Total Power Output

• Time Critical Projects

• Up to 3A Output Current

• Space Constrained High Thermal Requirement

• Input Voltage Range 4.5V to 20V

Applications

• Output Voltage Range 0.8V to 6V

• Negative Output Voltage Applications

• Efficiency up to 92%

(See AN-2027) SNVA425

PERFORMANCE BENEFITS

• Operates at High Ambient Temperature with

no Thermal Derating

• High Efficiency Reduces System Heat

Generation

• Low Radiated Emissions (EMI) Complies with

EN55022 Class B Standard

• Passes 10V/m Radiated Immunity EMI Test

Figure 1. Easy To Use PFM 7 Pin Package

Standard EN61000 4-3

10.16 x 13.77 x 4.57 mm (0.4 x 0.542 x 0.18 in)

= 20°C/W, θ

= 1.9°C/W

RoHS Compliant

Peak Reflow Case Temp = 245°C

Power Module SMT Guidelines

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (25 pages)

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LMZ12003 www.ti.
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LMZ12003 SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com System Performance Figure 2. Efficiency VIN = 12V VOUT = 5.0V Figure 3. Thermal derating curve VIN = 12V VOUT = 5.0V Figure 4.
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LMZ12003 www.ti.com SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 Simplified Application Schematic VOUT FB SS GND EN VIN VIN RON LMZ12003 VOUT RFBT 5V 3.3V 2.5V 1.8V 1.5V 1.2V 0.8V 5.62k 3.32k 2.26k 1.87k 1.00k 4.22k 0 RFBB 1.07k 1.07k 1.07k 1.50k 1.13k 8.45k 39.2k RON VIN Range 100k 61.9k 47.5k 32.4k 28.0k 22.6k 24.9k 7.5...20V 6.0...20V 5.5...20V 4.5...20V 4.5...20V 4.5...19V 4.5...18V VOUT @ 3A CFF RON 0.022 PF RFBT See Table Enable See Table CIN CSS RFBB 10 PF 0.
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LMZ12003 SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 Absolute Maximum Ratings www.ti.com (1) (2) VIN, RON to GND -0.3V to 25V EN, FB, SS to GND -0.3V to 7V Junction Temperature 150°C Storage Temperature Range -65°C to 150°C ESD Susceptibility (3) ± 2 kV Peak Reflow Case Temperature (30 sec) 245°C For soldering specifications, refer to the following document: www.ti.com/lit/snoa549c (1) (2) (3) Absolute Maximum Ratings are limits beyond which damage to the device may occur.
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LMZ12003 www.ti.com SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 Electrical Characteristics (continued) Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
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LMZ12003 SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 6V Input @ 25°C Dissipation 6V Input @ 25°C Figure 6. Figure 7. Efficiency 12V Input @ 25°C Dissipation 12V Input @ 25°C 100 2.5 95 2 5.0 3.3 2.5 85 80 DISSIPATION (W) EFFICIENCY (%) 90 1.8 1.5 1.2 75 70 0.
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LMZ12003 www.ti.com SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Efficiency 8V Input @ 85°C Dissipation 8V Input @ 85°C 3 100 95 5.0 3.3 2.5 85 80 75 DISSIPATION (W) EFFICIENCY (%) 5.0 2.5 90 1.8 1.5 70 1.2 65 60 0.8 3.3 2.5 2 1.8 1.5 1.5 1.2 1 0.8 0.
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LMZ12003 SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12V; Cin = 10uF X7R Ceramic; CO = 100uF X7R Ceramic; Tambient = 25 C for efficiency curves and waveforms. Transient Response 12VIN 3.3VO 0.6A to 3A Step Thermal Derating VOUT = 1.8V 3.5 12VIN OUTPUT CURRENT (A) 3 2.5 4.5VIN 2 4.5VIN 1.5 20VIN 1 JA = 19.6°C/W 0.5 VOUT = 1.
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LMZ12003 www.ti.com SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 APPLICATION BLOCK DIAGRAM Vin VIN 1 Linear reg CIN Cvcc 5 SS Css CBST 3 EN RON 2 VOUT 7 RON Timer CFF 6 6.8 éH VO Co FB RFBT RFBB 0.
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LMZ12003 SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com COT CONTROL CIRCUIT OVERVIEW Constant On Time control is based on a comparator and an on-time one shot, with the output voltage feedback compared with an internal 0.8V reference. If the feedback voltage is below the reference, the main MOSFET is turned on for a fixed on-time determined by a programming resistor RON. RON is connected to VIN such that ontime is reduced with increasing input supply voltage.
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LMZ12003 www.ti.com SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 For VO = 0.8V the FB pin can be connected to the output directly so long as an output preload resistor remains that draws more than 20uA. Converter operation requires this minimum load to create a small inductor ripple current and maintain proper regulation when no load is present. A feed-forward capacitor is placed in parallel with RFBT to improve load step transient response.
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LMZ12003 SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Recommended minimum input capacitance is 10uF X7R ceramic with a voltage rating at least 25% higher than the maximum applied input voltage for the application. It is also recommended that attention be paid to the voltage and temperature deratings of the capacitor selected.
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LMZ12003 www.ti.com SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 Following is a comparison pair of waveforms of the showing both CCM (upper) and DCM operating modes. Figure 20. CCM and DCM Operating Modes VIN = 12V, VO = 3.3V, IO = 3A/0.4A 2 μsec/div The approximate formula for determining the DCM/CCM boundary is as follows: IDCB≊VO*(VIN–VO)/(2*6.8 μH*fSW(CCM)*VIN) (16) Following is a typical waveform showing the boundary condition. Figure 21. Transition Mode Operation VIN = 12V, VO = 3.3V, IO = 0.
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LMZ12003 SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com As a result, approximately 31 square cm of 1 oz copper on top and bottom layers is required for the PCB design. The PCB copper heat sink must be connected to the exposed pad. Approximately thirty six, 8 mils thermal vias spaced 59 mils (1.5 mm) apart must connect the top copper to the bottom copper. For an example of a high thermal performance PCB layout, refer to the demo board application note AN-2024 SNVA422.
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LMZ12003 www.ti.com SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 Additional Features OUTPUT OVER-VOLTAGE COMPARATOR The voltage at FB is compared to a 0.92V internal reference. If FB rises above 0.92V the on-time is immediately terminated. This condition is known as over-voltage protection (OVP). It can occur if the input voltage is increased very suddenly or if the output load is decreased very suddenly. Once OVP is activated, the top MOSFET on-times will be inhibited until the condition clears.
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LMZ12003 SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Evaluation Board Schematic Diagram U1 EP VIN Enable VOUT 1.8VO @ 3A 7 FB SS 6 GND 5 VIN EN 4 3 2 1 RON LMZ12003TZ-ADJ 4.5V to 20V RENT CFF 32.4k 0.022 PF RON RFBT 32.4k RENB 11.8k 16 1.37k CIN2 CIN1 CSS RFBB 10 PF 1 PF 0.022 PF 1.
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LMZ12003 www.ti.com SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 Figure 23. Top And Bottom View Of Evaluation PCB Power Module SMT Guidelines The recommendations below are for a standard module surface mount assembly • Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads.
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LMZ12003 SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 www.ti.com Figure 24. Sample Reflow Profile Table 1. 18 Probe Max Temp (°C) Reached Max Temp Time Above 235°C Reached 235°C Time Above 245°C Reached 245°C Time Above 260°C Reached 260°C #1 242.5 6.58 0.49 6.39 0.00 – 0.00 – #2 242.5 7.10 0.55 6.31 0.00 7.10 0.00 – #3 241.0 7.09 0.42 6.44 0.00 – 0.
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LMZ12003 www.ti.com SNVS636N – DECEMBER 2009 – REVISED OCTOBER 2013 REVISION HISTORY Changes from Revision M (March 2013) to Revision N Page • Added Peak Reflow Case Temp = 245°C ............................................................................................................................ 1 • Deleted 12mils ......................................................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 13-Sep-2014 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LMZ12003TZ-ADJ/NOPB LMZ12003TZX-ADJ/NOP B Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TOPMOD NDW 7 250 330.0 24.4 10.6 14.22 5.0 16.0 24.0 Q2 TOPMOD NDW 7 500 330.0 24.4 10.6 14.22 5.0 16.0 24.
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PACKAGE MATERIALS INFORMATION www.ti.com 24-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMZ12003TZ-ADJ/NOPB TO-PMOD NDW 7 250 367.0 367.0 45.0 LMZ12003TZX-ADJ/NOPB TO-PMOD NDW 7 500 367.0 367.0 45.
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MECHANICAL DATA NDW0007A BOTTOM SIDE OF PACKAGE TOP SIDE OF PACKAGE TZA07A (Rev D) www.ti.
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