Datasheet

LMZ12003EXT

SNVS663G –JUNE 2010–REVISED OCTOBER 2013

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Power Module SMT Guidelines

The recommendations below are for a standard module surface mount assembly

• Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads

• Stencil Aperture

– For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land

pattern

– For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation

• Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher

• Stencil Thickness – 0.125 to 0.15mm

• Reflow - Refer to solder paste supplier recommendation and optimized per board size and density

• Maximum number of reflows allowed is one

Figure 28. Sample Reflow Profile

Table 1.

Max Temp Reached Time Above Reached Time Above Reached Time Above Reached

Probe

(°C) Max Temp 235°C 235°C 245°C 245°C 260°C 260°C

#1 242.5 6.58 0.49 6.39 0.00 – 0.00 –

#2 242.5 7.10 0.55 6.31 0.00 7.10 0.00 –

#3 241.0 7.09 0.42 6.44 0.00 – 0.00 –

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