Datasheet

Exposed Pad
Connect to GND
5
FB
6
VOUT
3
SS
1
VIN
2
EN
4
GND
7
VOUT
VIN
EN
GND
FB
VOUT
LMZ10504
V
IN
V
OUT
SS
C
in
C
O
R
fbt
R
comp
C
comp
R
fbb
C
SS
1
2
3
4, EP
5
6, 7
LMZ10504
www.ti.com SNVS610M –DECEMBER 2009–REVISED OCTOBER 2013
Typical Application Circuit
Connection Diagram
Figure 5. Top View
7-Lead PFM
Package Number NDW0007A
PIN DESCRIPTIONS
Pin Number Name Description
1 VIN Power supply input. A low ESR input capacitance should be located as close as possible to the VIN pin and
exposed pad (EP).
2 EN Active high enable input for the device.
3 SS Soft-start control pin. An internal 2 µA current source charges an external capacitor connected between SS
and GND pins to set the output voltage ramp rate during startup. The SS pin can also be used to configure
the tracking feature.
4 GND Power ground and signal ground. Provide a direct connection to the EP. Place the bottom feedback resistor
as close as possible to GND and FB pin.
5 FB Feedback pin. This is the inverting input of the error amplifier used for sensing the output voltage. Keep the
copper area of this node small.
6, 7 VOUT The output terminal of the internal inductor. Connect the output filter capacitor between VOUT pin and EP.
EP Exposed Exposed pad is used as a thermal connection to remove heat from the device. Connect this pad to the PC
Pad board ground plane in order to reduce thermal resistance value. EP must also provide a direct electrical
connection to the input and output capacitors ground terminals. Connect EP to pin 4.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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