Datasheet

LMZ10503EXT
www.ti.com SNVS668G –JUNE 2010–REVISED OCTOBER 2013
Figure 28. Bottom Copper
Power Module SMT Guidelines
The recommendations below are for a standard module surface mount assembly
• Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads
• Stencil Aperture
– For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land
pattern
– For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation
• Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher
• Stencil Thickness – 0.125 to 0.15mm
• Reflow - Refer to solder paste supplier recommendation and optimized per board size and density
• Maximum number of reflows allowed is one
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