Datasheet

LMV951
SNOSAI3C –OCTOBER 2006–REVISED APRIL 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Supply Voltage (V
+
– V
−
) 3.1V
V
IN
Differential ±0.3V
Voltage at Input/Output Pin V
+
+0.3V, V
−
−0.3V
Current at Input Pin ±10 mA
Junction Temperature
(4)
+150°C
Mounting Temperature Infrared or Convection (20 sec) 235°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
OPERATING RATINGS
(1)
Temperature Range
(2)
−40°C to +125°C
Supply Voltage 0.9V to 3V
Thermal Resistance (θ
JA
)
(2)
170°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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