Datasheet

LMV851, LMV852, LMV854
SNOSAW1A –OCTOBER 2007–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
ESD Tolerance
(2)
Human Body Model 2 kV
Charge-Device Model 1 kV
Machine Model 200V
V
IN
Differential ± Supply Voltage
Supply Voltage (V
+
– V
−
) 6V
Voltage at Input/Output Pins V
+
+0.4V
V
−
−0.4V
Storage Temperature Range −65°C to +150°C
Junction Temperature
(3)
+150°C
Soldering Information
Infrared or Convection (20 sec) +260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to +125°C
Supply Voltage (V
+
– V
−
) 2.7V to 5.5V
Package Thermal Resistance (θ
JA
(2)
)
5-Pin SC70 313 °C/W
8-Pin VSSOP 217 °C/W
14-Pin TSSOP 135 °C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
3.3V Electrical Characteristics
(1)
Unless otherwise specified, all limits are specified for T
A
= 25°C, V
+
= 3.3V, V
−
= 0V, V
CM
= V
+
/2, and R
L
= 10 kΩ to V
+
/2.
Boldface limits apply at the temperature extremes.
Parameter Test Conditions Min
(2)
Typ
(3)
Max
(2)
Units
V
OS
Input Offset Voltage ±0.26 ±1
mV
See
(4)
±1.2
TCV
OS
Input Offset Voltage Drift
(5)
±0.4 ±2
μV/°C
See
(4)
I
B
Input Bias Current
(5)
0.1 10
pA
500
(1) Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using
statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(4) The typical value is calculated by applying absolute value transform to the distribution, then taking the statistical average of the resulting
distribution
(5) This parameter is specified by design and/or characterization and is not tested in production.
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