Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV841MG/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LMV841MGX/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LMV841QMG/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LMV841QMGX/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LMV842MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV842MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV842MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV842QMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV842QMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV842QMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV844MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMV844MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0
LMV844QMAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2