Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV821M5 SOT-23 DBV 5 1000 210.0 185.0 35.0
LMV821M5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMV821M5X SOT-23 DBV 5 3000 210.0 185.0 35.0
LMV821M5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMV821M7 SC70 DCK 5 1000 210.0 185.0 35.0
LMV821M7/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LMV821M7X SC70 DCK 5 3000 210.0 185.0 35.0
LMV821M7X/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LMV822MM VSSOP DGK 8 1000 210.0 185.0 35.0
LMV822MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV822MMX VSSOP DGK 8 3500 367.0 367.0 35.0
LMV822MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV822MX SOIC D 8 2500 367.0 367.0 35.0
LMV822MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV824MTX TSSOP PW 14 2500 367.0 367.0 35.0
LMV824MX SOIC D 14 2500 367.0 367.0 35.0
LMV824MX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Nov-2013
Pack Materials-Page 2