Datasheet
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMV821M5 NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 A14
LMV821M5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A14
LMV821M5X NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 85 A14
LMV821M5X/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A14
LMV821M7 NRND SC70 DCK 5 1000 TBD Call TI Call TI -40 to 85 A15
LMV821M7/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A15
LMV821M7X NRND SC70 DCK 5 3000 TBD Call TI Call TI -40 to 85 A15
LMV821M7X/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 A15
LMV822M NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMV
822M
LMV822M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMV
822M
LMV822MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 V822
LMV822MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 V822
LMV822MMX NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 85 V822
LMV822MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 V822
LMV822MX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LMV
822M
LMV822MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMV
822M
LMV822Q1MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AKAA
LMV822Q1MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 AKAA
LMV824M NRND SOIC D 14 55 TBD Call TI Call TI -40 to 85 LMV824M
LMV824M/NOPB ACTIVE SOIC D 14 55 Green (RoHS
& no Sb/Br)
SN | CU SN Level-1-260C-UNLIM -40 to 85 LMV824M