Datasheet

LMV793, LMV794
SNOSAX6D –MARCH 2007–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Human Body Model 2000V
ESD Tolerance
(3)
Machine Model 200V
Charge-Device Model 1000V
V
IN
Differential ±0.3V
Supply Voltage (V
+
– V
−
) 6.0V
Input/Output Pin Voltage V
+
+0.3V, V
−
−0.3V
Storage Temperature Range −65°C to 150°C
Junction Temperature
(4)
+150°C
Infrared or Convection (20 sec) 235°C
Soldering Information
Wave Soldering Lead Temp (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to 125°C
−40°C ≤ T
A
≤ 125°C 2.0V to 5.5V
Supply Voltage (V
+
– V
−
)
0°C ≤ T
A
≤ 125°C 1.8V to 5.5V
5-Pin SOT-23 180°C/W
Package Thermal Resistance (θ
JA
(2)
) 8-Pin SOIC 190°C/W
8-Pin VSSOP 236°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
2.5V Electrical Characteristics
(1)
Unless otherwise specified, all limits are specified for T
A
= 25°C, V
+
= 2.5V, V
−
= 0V, V
CM
= V
+
/2 = V
O
. Boldface limits apply
at the temperature extremes.
Symbol Parameter Conditions Min Typ Max Units
(2) (3) (2)
V
OS
Input Offset Voltage 0.1 ±1.35
mV
±1.65
TC V
OS
Input Offset Voltage Temperature Drift
(4)
LMV793 −1.0
μV/°C
LMV794 −1.8
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T
J
= T
A
. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where T
J
> T
A
.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using the
statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(4) Offset voltage average drift is determined by dividing the change in V
OS
by temperature change.
2 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated
Product Folder Links: LMV793 LMV794