Datasheet

LMV791, LMV792
SNOSAG6F –SEPTEMBER 2005–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Charge-Device Model 1000V
V
IN
Differential ±0.3V
Supply Voltage (V
+
– V
−
) 6.0V
Input/Output Pin Voltage V
+
+0.3V, V
−
−0.3V
Storage Temperature Range −65°C to 150°C
Junction Temperature
(4)
+150°C
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model is 1.5 kΩ in series with 100 pF. Machine Model is 0Ω in series with 200 pF
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to 125°C
Supply Voltage (V
+
– V
−
)
−40°C ≤ T
A
≤ 125°C 2.0V to 5.5V
0°C ≤ T
A
≤ 125°C 1.8V to 5.5V
Package Thermal Resistance (θ
JA
)
(2)
6-Pin SOT 170°C/W
10-Pin VSSOP 236°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
2.5V Electrical Characteristics
Unless otherwise specified, all limits are ensured for T
A
= 25°C, V
+
= 2.5V, V
−
= 0V, V
CM
= V
+
/2 = V
O
, V
EN
= V
+
. Boldface
limits apply at the temperature extremes.
Symbol Parameter Conditions Min Typ Max Units
(1) (2) (1)
V
OS
Input Offset Voltage 0.1 ±1.35
mV
±1.65
TC V
OS
Input Offset Voltage Temperature Drift LMV791
(3)
−1.0
μV/°C
LMV792
(3)
−1.8
I
B
Input Bias Current V
CM
= 1.0V
(4) (5)
−40°C ≤ T
A
≤ 85 °C 0.05 1
25
pA
−40°C ≤ T
A
≤ 85 °C 0.05 1
100
I
OS
Input Offset Current V
CM
= 1.0V
(5)
10 fA
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using the
statistical quality control (SQC) method.
(2) Typical values represent the parametric norm at the time of characterization.
(3) Offset voltage average drift is determined by dividing the change in V
OS
by temperature change.
(4) Positive current corresponds to current flowing into the device.
(5) This parameter is specified by design and/or characterization and is not tested in production.
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