Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV771MG SC70 DCK 5 1000 210.0 185.0 35.0
LMV771MG/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LMV771MGX/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LMV772MAX SOIC D 8 2500 367.0 367.0 35.0
LMV772MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV772MM VSSOP DGK 8 1000 210.0 185.0 35.0
LMV772MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV772MMX VSSOP DGK 8 3500 367.0 367.0 35.0
LMV772MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV772QMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV772QMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2