Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV761MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV761MF SOT-23 DBV 6 1000 210.0 185.0 35.0
LMV761MF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
LMV761MFX SOT-23 DBV 6 3000 210.0 185.0 35.0
LMV761MFX/NOPB SOT-23 DBV 6 3000 210.0 185.0 35.0
LMV762MAX SOIC D 8 2500 367.0 367.0 35.0
LMV762MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV762MM VSSOP DGK 8 1000 210.0 185.0 35.0
LMV762MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV762MMX VSSOP DGK 8 3500 367.0 367.0 35.0
LMV762MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV762QMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV762QMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV762QMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2