Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMV761MA NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LMV76
1MA
LMV761MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LMV76
1MA
LMV761MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LMV76
1MA
LMV761MF NRND SOT-23 DBV 6 1000 TBD Call TI Call TI -40 to 125 C22A
LMV761MF/NOPB ACTIVE SOT-23 DBV 6 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 C22A
LMV761MFX NRND SOT-23 DBV 6 3000 TBD Call TI Call TI -40 to 125 C22A
LMV761MFX/NOPB ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 C22A
LMV762MA NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LMV7
62MA
LMV762MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LMV7
62MA
LMV762MAX NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LMV7
62MA
LMV762MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LMV7
62MA
LMV762MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 C23A
LMV762MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 C23A
LMV762MMX NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 125 C23A
LMV762MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 C23A
LMV762QMA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LMV76
2QMA
LMV762QMAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 LMV76
2QMA
LMV762QMM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 C32A
LMV762QMMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 C32A