Datasheet

LMV7231
SNOSB45E –FEBRUARY 2010–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Supply Voltage 6V
Voltage at Input/Output Pin 6V to (GND − 0.3V)
Output Current 10mA
Total Package Current 50mA
Storage Temp Range −65°C to +150°C
Junction Temperature
(4)
150°C
For soldering specifications: http://www.ti.com/lit/SNOA549
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
) / θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Supply Voltage 2.2V to 5.5V
Junction Temperature Range
(2)
−40°C to +125°C
Package Thermal Resistance, θ
JA
24 Lead WQFN 38°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
) / θ
JA
. All numbers apply for packages soldered directly onto a PC board.
+3.3V Electrical Characteristics
Unless otherwise specified, all limits ensured for T
A
= 25°C, V+ = 3.3V ±10%, GND = 0V, and R
L
> 1MΩ. Boldface limits
apply for T
A
= –10°C to +70°C.
Symbol Parameter Condition Min
(1)
Typ
(2)
Max
(1)
ns Units
394 400 406
V
THR
Threshold: Input Rising R
L
= 10kΩ mV
391.4 408.6
386 394 401
V
THF
Threshold: Input Falling R
L
= 10kΩ mV
383.8 403.2
V
HYST
Hysteresis (V
THR
− V
THF
) R
L
= 10kΩ 3.9 6.0 8.8 mV
–5 0.05 5
I
BIAS
Input Bias Current V
IN
= V+, GND, and 5.5V nA
–15 15
160 200
V
OL
Output Low Voltage I
L
= 5mA mV
250
V
OUT
= V+, 5.5V and 0.4
I
OFF
Output Leakage Current μA
40mV of overdrive 1
High-to-Low Propagation Delay (+IN 2.6 6
t
PDHL1
10mV of overdrive μs
falling)
t
PDHL2
High-to-Low Propagation Delay (-IN 5.4 10
10mV of overdrive μs
rising)
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using the
Statistical Quality Control (SQC) method.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
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