Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV721M5 SOT-23 DBV 5 1000 210.0 185.0 35.0
LMV721M5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMV721M5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMV721M7 SC70 DCK 5 1000 210.0 185.0 35.0
LMV721M7/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LMV721M7X SC70 DCK 5 3000 210.0 185.0 35.0
LMV721M7X/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LMV722MM VSSOP DGK 8 1000 210.0 185.0 35.0
LMV722MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV722MMX VSSOP DGK 8 3500 367.0 367.0 35.0
LMV722MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV722MX SOIC D 8 2500 367.0 367.0 35.0
LMV722MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2