Datasheet
LMV712-N
SNOS534G –MAY 2004–REVISED MARCH 2010
www.ti.com
Typical Application Circuit
Figure 1. P.A. Control Loop
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 1.5kV
Machine Model 150V
Differential Input Voltage ±Supply Voltage
Voltage at Input/Output Pin (V
+
) +0.4V to (V
−
) −0.4V
Supply Voltage (V
+
- V
−
) 6V
Output Short Circuit V
+ (4)
Output Short Circuit V
− (4)
Current at Input Pin ±10mA
Current at Output Pin ±50mA
Storage Temp Range −65°C to 150°C
Junction Temperature T
JMAX
(5)
150°C
Soldering specification for WSON SnPb:
Infrared or Convection (20sec) 235°C
Soldering specification for all other packages:
see product folder at www.national.com and
www.national.com/ms/MS/MS-SOLDERING.pdf
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Shorting circuit output to either V
+
or V
−
will adversely affect reliability.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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