Datasheet

LMV651, LMV652, LMV654
SNOSAI7J –SEPTEMBER 2005–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 100V
Differential Input V
ID
±0.3V
Supply Voltage (V
S
= V
+
- V
−
) 6V
Input/Output Pin Voltage V
+
+0.3V, V
−
−0.3V
Storage Temperature Range −65°C to 150°C
Junction Temperature
(4)
150°C
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temperature (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to 125°C
Supply Voltage 2.7V to 5.5V
Package Thermal Resistance (θ
JA
)
(2)
5-Pin SC70 456°C/W
5-Pin SOT-23 234°C/W
8-Pin VSSOP 234°C/W
14-Pin TSSOP 160°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
3V DC Electrical Characteristics
Unless otherwise specified, all limits are specified for T
A
= 25°C, V
+
= 3V, V
−
= 0V, V
O
= V
CM
= V
+
/2, and R
L
> 1 MΩ.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min Typ Max Units
(1) (2) (1)
V
OS
Input Offset Voltage 0.1 ±1.5 mV
2.7
TC V
OS
Input Offset Average Drift 6.6 μV/°C
I
B
Input Bias Current See
(3)
80 120 nA
I
OS
Input Offset Current 2.2 15 nA
CMRR Common Mode Rejection Ratio 0 ≤ V
CM
≤ 2.0 V 87 100 dB
80
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using
Statistical Quality Control (SQC) method.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(3) Positive current corresponds to current flowing into the device.
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