Datasheet
LMV641
SNOSAW3C –SEPTEMBER 2007–REVISED FEBRUARY 2013
www.ti.com
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Differential Input V
ID
±0.3V
Supply Voltage (V
S
= V
+
- V
−
) 13.2V
Input/Output Pin Voltage V
+
+0.3V, V
−
−0.3V
Storage Temperature Range −65°C to +150°C
Junction Temperature
(4)
+150°C
Soldering Information
Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to 125°C
Supply Voltage (V
S
= V
+
- V
−
) 2.7V to 12V
Package Thermal Resistance (θ
JA
)
(2)
5-Pin SC70 456°C/W
8-Pin SOIC 166°C/W
5-Pin SOT-23 325°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
2.7V DC Electrical Characteristics
Unless otherwise specified, all limits are guaranteed for T
A
= 25°C, V
+
= 2.7V, V
−
= 0V, V
O
= V
CM
= V
+
/2, and R
L
> 1 MΩ.
Boldface limits apply at the temperature extremes.
Min Typ Max
Symbol Parameter Conditions Units
(1) (2) (1)
30 500 µV
V
OS
Input Offset Voltage
750
TC V
OS
Input Offset Average Drift 0.1 μV/°C
75 95 nA
I
B
Input Bias Current
(3)
110
I
OS
Input Offset Current 0.9 5 nA
89 114
CMRR Common Mode Rejection Ratio 0V ≤ V
CM
≤ 1.7V dB
84
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlations using
Statistical Quality Control (SQC) method.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
(3) Positive current corresponds to current flowing into the device.
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