Datasheet

LMV551, LMV552
SNOSAQ5G –FEBRUARY 2007–REVISED FEBRUARY 2013 www.ti.com
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model
LMV551/LMV552/LMV554 2 KV
Machine Model
LMV551 100V
LMV552/LMV554 250V
V
IN
Differential (@ V
+
= 5V) ±2.5V
Supply Voltage (V
+
- V
−
) 6V
Voltage at Input/Output pins V
+
+0.3V, V
−
−0.3V
Storage Temperature Range −65°C to 150°C
Junction Temperature
(4)
150°C
Soldering Information
Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp. (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to 125°C
Supply Voltage (V
+
– V
−
) 2.7V to 5.5V
Package Thermal Resistance (θ
JA
(2)
)
5-Pin SC70 456°C/W
5-Pin SOT-23 234°C/W
8-Pin VSSOP 235°C/W
14-Pin TSSOP 160°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
3V Electrical Characteristics
Unless otherwise specified, all limits are guaranteed for T
A
= 25°C, V
+
= 3V, V
−
= 0V, V
CM
= V
+
/2 = V
O
. Boldface limits apply
at the temperature extremes.
(1)
Symbol Parameter Conditions Min Typ Max Units
(2) (3) (2)
V
OS
Input Offset Voltage 1 3
mV
4.5
TC V
OS
Input Offset Average Drift 3.3 μV/°C
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T
J
= T
A
. No guarantee of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where T
J
> T
A
.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlations using
statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
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