Datasheet

V
+
V
O
−
+
V
I
−
+
C = 200 pF
V
+
Sample
Clock
LMV341, LMV342, LMV344
SLOS447H –SEPTEMBER 2004–REVISED JUNE 2012 www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
Reel of 3000 LMV341IDBVR RC9_
SOT-23 – DBV
Reel of 250 LMV341IDBVT Product Preview
Single
Reel of 3000 LMV341IDCKR R4_
SC-70 – DCK
Reel of 250 LMV341IDCKT Product Preview
Tube of 75 LMV342ID
SOIC – D MV342I
Reel of 2500 LMV342IDR
–40°C to 125°C Dual
Reel of 250 LMV342IDGK
MSOP/VSSOP – DGK RP_
Reel of 2500 LMV342IDGKR
Tube of 50 LMV344ID
SOIC – D LMV344I
Reel of 2500 LMV344IDR
Quad
Tube of 90 LMV344IPW
TSSOP – PW MV344I
Reel of 2000 LMV344IPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
Figure 1. APPLICATION CIRCUIT: SAMPLE-AND-HOLD CIRCUIT
2 Submit Documentation Feedback Copyright © 2004–2012, Texas Instruments Incorporated
Product Folder Link(s): LMV341 LMV342 LMV344