Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMV331M5 NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 C12
LMV331M5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 C12
LMV331M5X NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 85 C12
LMV331M5X/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 C12
LMV331M7 NRND SC70 DCK 5 1000 TBD Call TI Call TI -40 to 85 C13
LMV331M7/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 C13
LMV331M7X NRND SC70 DCK 5 3000 TBD Call TI Call TI -40 to 85 C13
LMV331M7X/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 C13
LMV339M NRND SOIC D 14 55 TBD Call TI Call TI -40 to 85 LMV339M
LMV339M/NOPB ACTIVE SOIC D 14 55 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMV339M
LMV339MT NRND TSSOP PW 14 94 TBD Call TI Call TI -40 to 85 LMV339
MT
LMV339MT/NOPB ACTIVE TSSOP PW 14 94 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMV339
MT
LMV339MTX NRND TSSOP PW 14 2500 TBD Call TI Call TI -40 to 85 LMV339
MT
LMV339MTX/NOPB ACTIVE TSSOP PW 14 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMV339
MT
LMV339MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMV339M
LMV393M NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LMV
393M
LMV393M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 LMV
393M
LMV393MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 85 V393
LMV393MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 85 V393
LMV393MMX NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 85 V393