Datasheet
Table Of Contents
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
LMV331IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0
LMV331IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0
LMV331IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
LMV331IDCKR SC70 DCK 5 3000 205.0 200.0 33.0
LMV331IDCKR SC70 DCK 5 3000 180.0 180.0 18.0
LMV331IDCKT SC70 DCK 5 250 180.0 180.0 18.0
LMV331IDCKT SC70 DCK 5 250 205.0 200.0 33.0
LMV339IDR SOIC D 14 2500 367.0 367.0 38.0
LMV339IPWR TSSOP PW 14 2000 367.0 367.0 35.0
LMV339IRUCR QFN RUC 14 3000 202.0 201.0 28.0
LMV393IDDUR VSSOP DDU 8 3000 202.0 201.0 28.0
LMV393IDGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LMV393IDR SOIC D 8 2500 364.0 364.0 27.0
LMV393IDR SOIC D 8 2500 340.5 338.1 20.6
LMV393IDRG4 SOIC D 8 2500 340.5 338.1 20.6
LMV393IPWR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Oct-2013
Pack Materials-Page 2