Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV321Q3M5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMV324MTX TSSOP PW 14 2500 367.0 367.0 35.0
LMV324MX SOIC D 14 2500 367.0 367.0 35.0
LMV324MX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMV324Q1MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMV324Q3MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMV358MM VSSOP DGK 8 1000 210.0 185.0 35.0
LMV358MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV358MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV358MX SOIC D 8 2500 367.0 367.0 35.0
LMV358MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV358Q1MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV358Q1MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV358Q1MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMV358Q3MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMV358Q3MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMV358Q3MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2013
Pack Materials-Page 3