Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LMV358MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMV358MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMV358Q1MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMV358Q1MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV358Q1MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV358Q3MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMV358Q3MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMV358Q3MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV321M5 SOT-23 DBV 5 1000 210.0 185.0 35.0
LMV321M5X SOT-23 DBV 5 3000 210.0 185.0 35.0
LMV321M7 SC70 DCK 5 1000 210.0 185.0 35.0
LMV321M7/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LMV321M7X SC70 DCK 5 3000 210.0 185.0 35.0
LMV321M7X/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LMV321Q1M5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMV321Q1M5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMV321Q3M5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Oct-2013
Pack Materials-Page 2