Datasheet
LMV116, LMV118
SNOSA87B –OCTOBER 2003–REVISED MAY 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance Human Body 2KV
(3)
Machine Model 200V
(4)
V
IN
Differential ±2.5V
Output Short Circuit Duration See
(5)
,
(6)
Supply Voltage (V
+
- V
−
) 12.6V
Voltage at Input/Output pins V
+
+0.8V, V
−
−0.8V
Storage Temperature Range −65°C to +150°C
Junction Temperature
(7)
+150°C
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp. (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
(4) Machine Model, 0Ω in series with 200pF.
(5) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(6) Output short circuit duration is infinite for V
S
< 6V at room temperature and below. For V
S
> 6V, allowable short circuit duration is 1.5ms.
(7) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Supply Voltage (V
+
– V
−
) 2.5V to 12V
Temperature Range
(2)
−40°C to +85°C
Package Thermal Resistance
(2)
(θ
JA
) SOT-23-5 265°C/W
SOT-23-6 265°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
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