Datasheet
LMR62421
www.ti.com
SNVS734B –OCTOBER 2011–REVISED APRIL 2013
Electrical Characteristics
(1)(2)
Limits in standard type are for T
J
= 25°C only; limits in boldface type apply over the junction temperature range of
(T
J
= -40°C to 125°C). Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values
represent the most likely parametric norm at T
J
= 25°C, and are provided for reference purposes only. V
IN
= 5V unless
otherwise indicated under the Conditions column.
Symbol Parameter Conditions Min Typ Max Units
−40°C ≤ to T
J
≤ +125°C (SOT-23) 1.230 1.255 1.280
0°C ≤ to T
J
≤ +125°C (SOT-23) 1.236 1.255 1.274
V
FB
Feedback Voltage V
−40°C ≤ to T
J
≤ +125°C (WSON) 1.225 1.255 1.285
−0°C ≤ to T
J
≤ +125°C (WSON) 1.229 1.255 1.281
ΔV
FB
/V
IN
Feedback Voltage Line Regulation V
IN
= 2.7V to 5.5V 0.06 %/V
I
FB
Feedback Input Bias Current 0.1 1 µA
F
SW
Switching Frequency 1200 1600 2000 kHz
D
MAX
Maximum Duty Cycle 88 96 %
D
MIN
Minimum Duty Cycle 5 %
SOT-23 170 330
R
DS(ON)
Switch On Resistance mΩ
WSON 190 350
I
CL
Switch Current Limit 2.1 3 A
SS Soft Start 4 ms
Quiescent Current (switching) 7.0 11 mA
I
Q
Quiescent Current (shutdown) V
EN
= 0V 80 nA
Undervoltage Lockout VIN Rising 2.3 2.65 V
UVLO
VIN Falling 1.7 1.9
Shutdown Threshold Voltage See
(3)
0.4
V
EN_TH
V
Enable Threshold Voltage See
(3)
1.8
I
-SW
Switch Leakage V
SW
= 24V 1.0 µA
I
-EN
Enable Pin Current Sink/Source 100 nA
WSON 80
Junction to Ambient
θ
JA
°C/W
0 LFPM Air Flow
(4)
SOT-23 118
WSON 18
θ
JC
Junction to Case °C/W
SOT-23 60
T
SD
Thermal Shutdown Temperature
(5)
160 °C
Thermal Shutdown Hysteresis 10
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical numbers are at 25°C and represent the most likely parametric norm.
(3) Do not allow this pin to float or be greater than V
IN
+0.3V.
(4) Applies for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air.
(5) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.
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