Datasheet

LMR24210
SNVS738G –OCTOBER 2011–REVISED APRIL 2013 www.ti.com
interference) generation. If it is expected that the internal dissipation of the LMR24210 will produce excessive
junction temperature during normal operation, making good use of the PC board’s ground plane can help
considerably to dissipate heat. Additionally the use of thick traces, where possible, can help conduct heat away
from the LMR24210. Judicious positioning of the PC board within the end product, along with the use of any
available air flow (forced or natural convection) can help reduce the junction temperature.
Package Considerations
The die has exposed edges and can be sensitive to ambient light. For applications with direct high intensitiy
ambient red, infrared, LED or natural light it is recommended to have the device shielded from the light source to
avoid abnormal behavior.
Figure 27. Typical Application Schematic for V
OUT
= 3.3V
Figure 28. Typical Application Schematic for V
OUT
= 0.8V
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