Datasheet

LMR12010
www.ti.com
SNVS731A SEPTEMBER 2011REVISED SEPTEMBER 2011
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)(2)
V
IN
-0.5V to 24V
SW Voltage -0.5V to 24V
Boost Voltage -0.5V to 30V
Boost to SW Voltage -0.5V to 6.0V
FB Voltage -0.5V to 3.0V
EN Voltage -0.5V to (V
IN
+ 0.3V)
Junction Temperature 150°C
ESD Susceptibility
(3)
2kV
Storage Temp. Range -65°C to 150°C
For soldering specifications: see product folder at www.ti.com and literature number SNOA549
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 1.5k in series with 100pF.
OPERATING RATINGS
(1)
V
IN
3V to 20V
SW Voltage -0.5V to 20V
Boost Voltage -0.5V to 25V
Boost to SW Voltage 1.6V to 5.5V
Junction Temperature Range 40°C to +125°C
Thermal Resistance θ
JA
(2)
118°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see Electrical Characteristics.
(2) Thermal shutdown will occur if the junction temperature exceeds 165°C. The maximum power dissipation is a function of T
J(MAX)
, θ
JA
and T
A
. The maximum allowable power dissipation at any ambient temperature is P
D
= (T
J(MAX)
– T
A
)/θ
JA
. All numbers apply for
packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still
air, θ
JA
= 204°C/W.
ELECTRICAL CHARACTERISTICS
Specifications with standard typeface are for T
J
= 25°C, and those in boldface type apply over the full Operating
Temperature Range (T
J
= -40°C to 125°C). V
IN
= 5V, V
BOOST
- V
SW
= 5V unless otherwise specified. Datasheet min/max
specification limits are specified by design, test, or statistical analysis.
Min Typ Max
Symbol Parameter Conditions Units
(1) (2) (1)
V
FB
Feedback Voltage 0.784 0.800 0.816 V
ΔV
FB
/ΔV
IN
Feedback Voltage Line Regulation V
IN
= 3V to 20V 0.01 % / V
I
FB
Feedback Input Bias Current Sink/Source 10 250 nA
Undervoltage Lockout V
IN
Rising 2.74 2.90
UVLO Undervoltage Lockout V
IN
Falling 2.0 2.3 V
UVLO Hysteresis 0.30 0.44 0.62
LMR12010X 1.2 1.6 1.9
F
SW
Switching Frequency MHz
LMR12010Y 2.2 3.0 3.6
LMR12010X 85 92
D
MAX
Maximum Duty Cycle %
LMR12010Y 78 85
(1) Specified to TI’s Average Outgoing Quality Level (AOQL).
(2) Typicals represent the most likely parametric norm.
Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMR12010