Datasheet

LMP8602, LMP8602Q, LMP8603, LMP8603Q
SNOSB36D –JULY 2009–REVISED MARCH 2013 www.ti.com
DESCRIPTION (CONTINUED)
The mid-rail offset adjustment pin enables the user to use these devices for bidirectional single supply voltage
current sensing. The output signal is bidirectional and mid-rail referenced when this pin is connected to the
positive supply rail. With the offset pin connected to ground, the output signal is unidirectional and ground-
referenced.
The LMP8602 and LMP8603 are available in a 8–Pin SOIC package and in a 8–Pin VSSOP package.
The LMP8602Q and LMP8603Q incorporate enhanced manufacturing and support processes for the automotive
market, including defect detection methodologies. Reliability qualification is compliant with the requirements and
temperature grades defined in the AEC Q100 standard.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
For input pins only ±4000V
Human Body
For all other pins ±2000V
ESD Tolerance
(3)
Machine Model 200V
Charge Device Model 1000V
Supply Voltage (V
S
- GND) 6.0V
Continuous Input Voltage (−IN and +IN)
(4)
−22V to 60V
Transient (400 ms) −25V to 65V
Maximum Voltage at A1, A2, OFFSET and OUT Pins V
S
+0.3V and
GND -0.3V
Storage Temperature Range −65°C to 150°C
Junction Temperature
(5)
150°C
Mounting Temperature Infrared or Convection (20 sec) 235°C
Wave Soldering Lead (10 sec) 260°C
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
the device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be beyond such conditions. All voltages are
measured with respect to the ground pin, unless otherwise specified.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model per MIL-STD-883, Method 3015.7. Machine Model, per JESD22-A115-A. Field-Induced Charge-Device Model, per
JESD22-C101-C.
(4) For the VSSOP package, the bare board spacing at the solder pads of the package will be to small for reliable use at higher voltages
(V
CM
>25V) Therefore it is strongly advised to add a conformal coating on the PCB assembled with the LMP8602 and LMP8603.
(5) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
J(MAX)
, θ
JA
, and the ambient temperature,
T
A
. The maximum allowable power dissipation P
DMAX
= (T
J(MAX)
- T
A
) / θ
JA
or the number given in Absolute Maximum Ratings,
whichever is lower.
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