Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMP8602MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP8602MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMP8602MME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0
LMP8602MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMP8602QMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP8602QMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMP8602QMME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0
LMP8602QMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMP8603MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP8603MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMP8603MME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0
LMP8603MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMP8603QMAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP8603QMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMP8603QMME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0
LMP8603QMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2