Datasheet

LMP8601, LMP8601-Q1
SNOSAR2E SEPTEMBER 2008REVISED MARCH 2013
www.ti.com
DESCRIPTION (CONTINUED)
The mid-rail offset adjustment pin enables the user to use these devices for bidirectional single supply voltage
current sensing. The output signal is bidirectional and mid-rail referenced when this pin is connected to the
positive supply rail. With the offset pin connected to ground, the output signal is unidirectional and ground-
referenced .
The LMP8601Q incorporates enhanced manufacturing and support processes for the automotive market,
including defect detection methodologies. Reliability qualification is compliant with the requirements and
temperature grades defined in the AEC Q100 standard.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
ESD Tolerance
(2)
, Human Body For input pins only ±4000V
For all other pins ±2000V
Machine Model 200V
Charge Device Model 1000V
Supply Voltage (V
S
- GND) 6.0V
Continuous Input Voltage ((-IN and +IN) -22V to 60V
Transient (400 ms) -25V to 65V
Maximum Voltage at A1, A2, OFFSET and OUT Pins V
S
+0.3V and GND -0.3V
Storage Temperature Range -65°C to 150°C
Junction Temperature
(3)
150°C
Mounting Temperature Infrared or Convection (20 sec) 235°C
Wave Soldering Lead (10 sec) 260°C
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
the device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be beyond such conditions. All voltages are
measured with respect to the ground pin, unless otherwise specified.
(2) Human Body Model per MIL-STD-883, Method 3015.7. Machine Model, per JESD22-A115-A. Field-Induced Charge-Device Model, per
JESD22-C101-C.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
J(MAX)
, θ
JA
, and the ambient temperature,
T
A
. The maximum allowable power dissipation P
DMAX
= (T
J(MAX)
- T
A
)/ θ
JA
or the number given in Absolute Maximum Ratings, whichever
is lower.
Operating Ratings
(1)
Supply Voltage (V
S
– GND) 3.0V to 5.5V
Offset Voltage (Pin 7 ) 0 to V
S
Temperature Range
(2)
Packaged devices -40°C to +125°C
Package Thermal Resistance
(2)
8-Pin SOIC (θ
JA
) 190°C/W
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
the device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be beyond such conditions. All voltages are
measured with respect to the ground pin, unless otherwise specified.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
J(MAX)
, θ
JA
, and the ambient temperature,
T
A
. The maximum allowable power dissipation P
DMAX
= (T
J(MAX)
- T
A
)/ θ
JA
or the number given in Absolute Maximum Ratings, whichever
is lower.
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