Datasheet
LMP8350
www.ti.com
SNOSB80B –FEBRUARY 2011–REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2500 V
Machine Model 200V
Charge-Device Model 1250V
Output Short Circuit Duration See
(4)
V+ relative to V- -0.3 to +12.9V
IN+, IN-, OUT, EN and V
OCM
Pins V+ + 0.3V, V- – 0.3V
Input Current 1 mA
Storage Temperature Range −65°C to +150°C
Junction Temperature
(5)
+150°C
For soldering specifications: http://www.ti.com/lit/SNOA549
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The short circuit test is a momentary test which applies to both single-supply and split-supply operation. Continuous short circuit
operation at elevated ambient temperature can exceed the maximum allowable junction temperature of 150°C. Positive number (+) is
sourcing, negative number (-) is sinking.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
(1)
Temperature Range (T
A
) −40°C to +85°C
Supply Voltage (V
S
= V
+
– V
–
) 4.5V to 12V
Package Thermal Resistance (θ
JA
)
(2)
8-Pin SOIC 150°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMP8350