Datasheet

LMP7731
SNOSAT6E –JULY 2007–REVISED MARCH 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model Inputs pins only 2000V
All other pins 2000V
Machine Model 200V
Charge Device Model 1000V
V
IN
Differential ±2V
Supply Voltage (V
S
= V
+
– V
−
) 6.0V
Storage Temperature Range −65°C to 150°C
Junction Temperature
(4)
+150°C max
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp. (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
(1)
Temperature Range −40°C to 125°C
Supply Voltage (V
S
= V
+
– V
–
) 1.8V to 5.5V
Package Thermal Resistance (θ
JA
) 5-Pin SOT-23 265°C/W
8-Pin SOIC 190°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
2.5V Electrical Characteristics
(1)
Unless otherwise specified, all limits are ensured for T
A
= 25°C, V
+
= 2.5V, V
−
= 0V, V
CM
= V
+
/2, R
L
>10 kΩ to V
+
/2. Boldface
limits apply at the temperature extremes.
Parameter Test Conditions Min
(2)
Typ
(3)
Max
(2)
Units
±500
V
CM
= 2.0V ±9
±600
Input Offset Voltage
V
OS
μV
(4)
±500
V
CM
= 0.5V ±9
±600
V
CM
= 2.0V ±0.5 ±5.5
Input Offset Voltage Temperature
TCV
OS
μV/°C
Drift
V
CM
= 0.5V ±0.2 ±5.5
±30
V
CM
= 2.0V ±1
±45
I
B
Input Bias Current nA
±50
V
CM
= 0.5V ±12
±75
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T
J
= T
A
. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where T
J
> T
A
. Absolute maximum Ratings indicate junction temperature limits beyond which the
device maybe permanently degraded, either mechanically or electrically.
(2) All limits are specified by testing, statistical analysis or design.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(4) Ambient production test is performed at 25°C with a variance of ±3°C.
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