Datasheet
LMP7717, LMP7718
www.ti.com
SNOSAY7H –MARCH 2007–REVISED MARCH 2013
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Charge-Device Model 1000V
V
IN
Differential ±0.3V
Supply Voltage (V
+
– V
−
) 6.0V
Input/Output Pin Voltage V
+
+0.3V, V
−
−0.3V
Storage Temperature Range −65°C to 150°C
Junction Temperature
(4)
+150°C
For soldering specifications:
see product folder at www.ti.com/ and http://www.ti.com/lit/SNOA549
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see 5V Electrical Characteristics
()
.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to 125°C
Supply Voltage (V
+
– V
−
)
−40°C ≤ T
A
≤ 125°C 2.0V to 5.5V
0°C ≤ T
A
≤ 125°C 1.8V to 5.5V
Package Thermal Resistance (θ
JA
(2)
)
5-Pin SOT-23 180°C/W
8-Pin SOIC 190°C/W
8-Pin VSSOP 236°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see 5V Electrical Characteristics
()
.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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Product Folder Links: LMP7717 LMP7718