Datasheet

-200 -100 0 100 200
0
5
10
15
20
25
PERCENTAGE (%)
OFFSET VOLTAGE (PV)
V
S
= 5V
V
CM
= V
S
/2
UNITS TESTED: 10,000
1
10 100 10k 100k
FREQUENCY (Hz)
1
10
100
1k
VOLTAGE NOISE (nV/
Hz)
V
S
= 2.5V
V
S
= 5.5V
LMP7715, LMP7716, LMP7716Q
SNOSAV0E MARCH 2006REVISED MARCH 2013
www.ti.com
Typical Performance
Figure 1. Offset Voltage Distribution Figure 2. Input Referred Voltage Noise
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Human Body Model 2000V
ESD Tolerance
(3)
Machine Model 200V
Charge-Device Model 1000V
V
IN
Differential ±0.3V
Supply Voltage (V
S
= V
+
– V
) 6.0V
Voltage on Input/Output Pins V
+
+0.3V, V
0.3V
Storage Temperature Range 65°C to 150°C
Junction Temperature
(4)
+150°C
Infrared or Convection (20 sec) 235°C
Soldering Information
Wave Soldering Lead Temp. (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
(1)
Temperature Range
(2)
40°C to 125°C
0°C T
A
125°C 1.8V to 5.5V
Supply Voltage (V
S
= V
+
– V
)
40°C T
A
125°C 2.0V to 5.5V
5-Pin SOT-23 180°C/W
Package Thermal Resistance (θ
JA
(2)
)
8-Pin VSSOP 236°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
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